SMT BGA Voids Formation and Prevention-3
The formation of this phenomenon is related to the duration of action of the active material in the solder paste system and the duration of action.
During the BGA reflow soldering process, BGA pads are more prone to this undesirable phenomenon than SMT solder paste soldering.
After realizing these influencing factors, the corresponding testing measures were added in the research and development.
For example, we introduced a thermogravimetric analyzer to conduct thermal analysis on the materials to be used and the solder paste produced, to visually understand these thermal characteristics, and to test.
Differences between PCB design assumptions and actual performance, measures are taken to overcome PCB design to ultimately meet the PCB assembly process requirements; and surface tension measurements are performed.
